bond pad

基本解释

To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
钝化层（18）和聚酰亚胺层（22）将最后的互连层（16）和接合焊盘（28）隔开。
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A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
一种半导体器件（10），具有在最后的互连层（16）和接合焊盘之间的接触，该接合焊盘包括接合焊盘（28）和最后的互连层（16）之间的阻挡金属（26）。
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